Fiber laser cutting machine materials:Charry

Fiber laser cutting machine materials

Fiber laser cutting machine materials

Fiber laser cutting machine materials

Materials Analysis
With the development of laser cutting technology, the field of laser cutting is more and more extensive, and more and more applicable materials are use.

Structural steel

The material will give better results when cut with oxygen. When oxygen as a process gas, the cutting edge is slightly oxidized. For plates up to 4 mm in thickness, high pressure cutting can be perform with nitrogen as the process gas. In this case, the cutting edge will not be oxidize. For plates with a thickness of more than 10 mm, special electrodes are for the laser and the surface of the work piece can oil during processing to obtain better results.

stainless steel

Cutting stainless steel requires: use of oxygen, where edge oxidation does not matter. use nitrogen to obtain an oxide-free, burr-free edge that does not require further treatment. The coating film on the surface of the plate will get better perforation without reducing the processing quality.

aluminum

In spite of the high reflectance and thermal conductivity, aluminum materials with a thickness of 6 mm or less can cut, depending on the alloy type and laser capability. When cut with oxygen, the cutting surface is rough and hard. With nitrogen, the cutting surface is smooth. Pure aluminum is very difficult to cut because of its high purity. The aluminum can only cut when a «reflection absorbing» device is on the system. Otherwise the reflection will destroy the optical components.

Fiber laser cutting machine materials

titanium

Titanium plates are cut with argon and nitrogen as process gases. Other parameters can refer to nickel-chromium steel.

Copper and brass

Both materials have high reflect and very good thermal conductivity. Brass with a thickness of 1 mm or less can cut with nitrogen. copper with a thickness of 2 mm or less can cut, and the processing gas must be oxygen. Copper and brass can only cut when a «reflection absorbing» device is on the system. Otherwise the reflection will destroy the optical components.

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