Fiber optic laser cutting machine:Charry

Fiber optic laser cutting machine

Fiber optic laser cutting machine

Fiber optic laser cutting machine
XT LASER exhibition Moscow, Russia

The use of fiber lasers occupies a small area, the laser light source and the cooling system are smaller in size.

There is no laser gas line and there is no need to calibrate the lens. A fiber laser with a power of 2kw or 3kw only requires 50% of the energy of a 4kw or 6kw CO2 laser source to achieve the same performance.But with faster speeds, lower energy consumption, and less environmental impact.

The fiber laser uses a solid-state diode to pump molecules in a fiber. And the stimulate light passes through the core several times. And then forms a laser output through a transmission fiber to a focusing head for cutting.

Since all collisions between molecules occur in the fiber, laser gas is no need.So the energy is greatly reduce – about one third of the CO2 laser. Since the less heat is generate, the volume of the cooler can be reduce accordingly. In short, the overall energy consumption of a fiber laser is 70% lower than that of a CO2 laser, with the same performance.

The edge of the cover film cut by this laser system is neat, smooth, smooth and free of burrs. The burrs and glue after punching will be near the windows where the windows are inevitably by molds, etc. Such burrs and glues are difficult to remove after being laminate on the bonding pads. And will directly affect the subsequent Plating quality.

The characteristics of advance manufacturing technologies such as high flexibility. High precision, and high speed can enable circuit board manufacturers to change the traditional processing. And delivery methods of flexible boards in terms of technical level,economy, time, and autonomy.

Features

1. The advantages of laser cutting FPC

2. The laser has three main functions in the manufacturing process of the flexible circuit board: FPC exterior cutting, cover film opening, drilling and so on;

3. Use laser cutting directly according to CAD data, which is more convenient and faster, and can shorten the delivery cycle greatly;

4. It does not increase the processing difficulty due to complex shapes and tortuous paths;

5. When the cover film is opened, the edge of the cut cover film is neat, smooth, smooth and free from burrs. The use of molds and other machining methods to open the window will inevitably lead to burrs and overflow after punching near the window.

6. Flexible plate sample processing often results in the change of the cover film window due to the customer’s need to modify the line and pad positions. The conventional method requires the replacement or modification of the mold.

With laser processing, this problem can be solve, because you only need to import the modified CAD data, you can quickly and easily process the film you want to open the window, and you will win the market in terms of time and cost. Competition opportunities.

7. High precision laser processing is an ideal tool for flexible circuit board forming processing. The laser can process the material into any shape.

8. In the past mass production, many small parts were formed by pressing using a mechanically hard stamped mold. However, the large wear and long lead times of the hard dies are impractical and costly for the processing and forming of small parts.

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